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        H1170(黑)
        
				
			
        
			
        
				
        FEATURES
        Tg: ≥170oC (DSC)
        Excellent Anti-CAF resistance
        Excellent T/H reliability
        High Thermal Performance
        Excellent in Dimension Stability
        Excellent in Thickness Uniformity
        Excellent in Refractive index and Color consistency

        APPLICATIONS
        Mini/Micro LED Dispiay
        Computer
        Communication Equipment
        Automotive

        GENERAL PROPERTIES
        Item
        Test Condition
        Unit
        Spec
        Typical value
        Tg
        DSC
        ℃
        ≧170
        173
        Peel Strength 1oz
        288℃,10S
        N/mm
        ≧1.05
        1.20
        Thermal stress
        288℃,solder dip
        6
        >10
        180s No delamination
        Flexural Strength
        Warp
        N/mm2
        ≧415
        579
        Fill
        ≧345
        490
        Flammability
        E 24/125
        —
        UL94V-0
        V-0
        Surface Resistivity
        After moisture
        MΩ
        ≧1.0x104
        1.99x105
        Volume Resistivity
        After moisture
        MΩ·cm
        ≧1.0x106
        5.92x109
        Arc Resistance
        D 48/50+D 0.5/23
        S
        ≧60
        180
        Moisture Absorption
        D 24/23
        %
        ≦0.35
        0.12
        Td
        Weight Loss 5%
        ℃
        ≧340
        340
        CTE in XY/Z Axis
        Alpha 1
        TMA
        ppm / ℃
        ≦60
        45
        Alpha 2
        ppm / ℃
        ≦300
        250
        50-260℃
        %
        ≦3.0
        2.10
        T288(Unclad)
        TMA
        Min
        ≧5
        30
        T300(Unclad)
        TMA
        Min
        NA
        5
         
        u  Specimen thickness: 1.6mm
        u  Specification sheet: IPC-4101E/126 is for your reference only.
        u  Explanation: C: Humidity conditioning
           D: Immersion conditioning distilled water.
           E: Temperature conditioning